Teflon® Encapsulated O-Rings in the Semiconductor Industry

High purity Teflon® encapsulated o-rings are a component utilized within the semiconductor manufacturing industry. They are used to  assist in creating a plasma barrier, preventing contamination and ensuring the purity of the process.

M-Cor’s Teflon® encapsulated o-rings are designed and manufactured with high purity virgin fluoropolymer PFA and FEP semicon resin, for semiconductor equipment manufacturers and fabs.

 Semiconductor Production with  M-Cor’s Teflon® Encapsulated O-Rings

Challenge: Semiconductor equipment manufacturers and fabs face challenges due to the aggressive chemicals, high temperatures, and the requirement for ultra-clean conditions in processes like plasma etching. Standard o-rings often fail under these extreme conditions, leading to contamination and consequences for product quality and equipment integrity.

Solutions: M-Cor’s Teflon® encapsulated o-rings, combine the resilience and compression set resistance of an elastomeric core with the superior chemical resistance and purity of Teflon (PTFE) or its copolymers, FEP or PFA. This combination ensures that the o-rings can endure harsh environments.

Benefits in Semiconductor:

1. Chemical Resistance: FEP and PFA encapsulated o-rings offer resistance to the harsh chemicals used in plasma etching.
2. Temperature Range: PFA encapsulated o-rings are preferred for their higher temperature range, especially if temperatures exceed 200°C during the etching process.
3. Purity and Low Outgassing: Both FEP and PFA  have low outgassing rates for maintaining the purity required in semiconductor manufacturing.
4. Durable Under High Vacuum or Pressure Conditions: PFA encapsulation is preferred due its improved mechanical strength over FEP in high vacuum or pressure conditions.

Uses: FEP and PFA Teflon® encapsulated o-rings are the preferred choice, due to their for their higher temperature range and mechanical strength. They are used in the seals of plasma etching chambers, piping, and valves and prevent leaks that could lead to wafer contamination or equipment damage.

Conclusion:
M-Cor’s FEP and PFA Teflon® encapsulated o-rings solve critical challenges of chemical resistance, temperature compatibility and ultra-clean performance. Their ability to maintain integrity and performance under extreme conditions makes them a preferred choice for semiconductor manufacturers, ensuring product quality, process reliability, and cost-effectiveness.